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Google CEO is expected to meet with US President-elect Trump on December 13th, local time.Boeing will invest $1 billion to upgrade its infrastructure in South Carolina and recruit 500 people.Daiwa Securities SMBC Co., Ltd. downgraded Xinao Energy to Hold with a target price of HK$ 56.

The EUR/USD of the euro against the US dollar rose by 0.50% in the day and is now reported at 1.0518.BYD Lian Yubo: It is estimated that BYD will sell 4.25 million vehicles in the whole year. On December 13th, BYD's chief scientist Lian Yubo said: "Up to now, BYD has sold more than 10 million new energy vehicles. By the end of this month, we can probably achieve the annual sales of 4.25 million vehicles. " He also mentioned: "There are still some challenges in industrial development. For example, the overall anti-risk ability of our industrial chain needs to be improved, and there are still breakthroughs in chips, operating technologies, industrial software and nuclear materials. We still need to strengthen research and achieve complete autonomy and controllability."Italian Finance Minister: GDP will increase by 0.7% in 2024.

The U.S. Senate has obtained enough votes to confirm Biden's nominee, Marzano, as a member of the Nuclear Regulatory Commission.Huangshan Capsule: It is planned to distribute a cash dividend of 0.27 yuan for every 10 shares. Huangshan Capsule announced that the company held the board of directors and the board of supervisors on December 13, 2024, and reviewed and approved the profit distribution plan for the first three quarters of 2024. According to the plan, the company plans to distribute a cash dividend of RMB27 to all shareholders for every 10 shares based on the existing total share capital of 299 million shares, with a total cash dividend of RMB8,075,700. This profit distribution will not send bonus shares, and capital reserve will not be converted into share capital.Apple is about to switch to self-developed Bluetooth and Wi-Fi chips for iPhone and smart home. Apple plans to switch to domestic chips for Bluetooth and Wi-Fi connection on its devices from next year, which will gradually phase out some components currently provided by Broadcom. This chip, code-named Proxima, has been developed for several years and is now planned to be used in the first batch of iPhone and smart home devices produced in 2025. The internal chips of iPhone manufacturers will be produced by TSMC.